EPO-TEK® T7110-38 - Thermally Conductive, Room-Temperature Cure Epoxy

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping 

Low stress and low temperature cure temperature version of H35-175MP.

This elastomeric, Polyurea joint filler (formerly known as JF-311) allows 10-15% movement of installed joint width and can be used in temperatures between -40 °F to 120 °F (-40 °C to 49 °C). Available in cartridges and in...

HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.

Optically clear, low viscosity, 1:1 silicone potting system. Ideal for protection from shock and vibration. 

CRACKBOND® V65 HI-MOD (formerly known as CRACKBOND® HEALER/SEALER) is a two-component, deep penetrating, fast cure, high strength epoxy coating that will reduce intrusion of moisture and water soluble materials into concrete. The ultra-low viscosity (65 cP) allows superior...