Meridian offers specialized bonding solutions across diverse electronics applications, including MEMS, IC packaging, sensors, camera modules, RF, radar, consumer electronics, wearable devices, LED, displays, and more.
Our product range includes structural bonding adhesives & sealants, thermally conductive adhesives and encapsulants, electrically and thermally conductive adhesives, optical grade adhesives, dielectric encapsulating materials, and UV curable adhesives designed to meet industry-specific standards. These solutions are essential for applications such as underfill, die attachment, die encapsulating, chip bonding, glob top, lid attachment, substrate attachment, harsh environment protection, and thermal management, ensuring optimal performance and reliability in even the most demanding environments.
With a focus on precision and durability, our adhesives are integral to the development and innovation of advanced electronic devices and semiconductor technologies. Partner with us for cutting-edge, dependable electronic assembly solutions.
15 manufacturing facilities
18 R&D and QC support labs
25 total locations
Our capabilities
Technology
Meridian delivers specialized adhesive and sealant technologies for the Electronics market, ensuring precision, protection, and performance in highly sensitive applications.
- Advanced range of epoxy, and silicone technologies, tailored to meet the stringent requirements of the electronics industry.
- High-performance solutions designed to withstand thermal cycling, electrical insulation needs, and environmental exposure.
- Innovative, customized formulations developed through close collaboration with electronics manufacturers to support reliability and longevity in electronic components.
Applications
We empower the Electronics market with adhesive solutions designed to elevate device performance, protect sensitive components, and enable advanced miniaturization.
- Reliable adhesives for consumer electronics and PCBA, providing robust bonding, electrical insulation, and thermal management.
- High-precision materials for microelectronics and semiconductor applications, ensuring stability and protection for delicate components in compact devices.
- Tailored solutions that enhance manufacturing efficiency and ensure optimal performance in fast-evolving electronic technologies.
Featured Products
EPO-TEK® 377H
Graphite Filled Bonding Epoxy
Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.
50-3112
Fast Curing Epoxy Adhesive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.
EPO-TEK® H20S
Silver Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic
Downloads
Product Brochure
Product Brochure
Product Brochure
