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50-3141
Thermally Conductive
Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:! mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.
20-2175
Potting & Encapsulating
Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.
EPO-TEK® 730
General Bonding
All purpose thixotropic and room temperature-curing epoxy adhesive.
EPO-TEK® H70E
Thermally Conductive Adhesive
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
EPO-TEK® 730-110
General Bonding
Room temperature-curing, thermally and electrically insulating epoxy.
EPO-TEK® 377H
Electrically & Thermally Conductive Epoxy
Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.
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