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EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.
20-3302
Ultra Clear Epoxy Resin for Adhesives & Sealants
Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.
CRACKBOND® V200 HI-MOD
Low Viscosity Epoxy Sealer
CRACKBOND® V200 HI-MOD is a two-component, moisture insensitive, high modulus, high strength epoxy healer/sealer deck penetrant, designed to prolong the life of concrete by sealing cracks against moisture and preventing chloride ion intrusion. The super-low viscosity (200 cP),...
DP 3050 HV
High Viscosity Water Based Lagging Adhesive
A high viscosity, premium quality, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. DP 3050 HV can be used for bonding and coating jackets of canvas, glass cloth and other...
ULTRABOND® HYB-2CC
High Strength Concrete Anchoring Adhesive
For cracked and uncracked concrete, ULTRABOND® HYB-2CC is IBC approved for application in temperatures down to 23 °F. And for jobs where a quick cure rate is required, it will cure completely in 30 minutes at 70 °F. Approved...
EPO-TEK® H65-175MP
Thermally Conductive Epoxy
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.
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