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EPO-TEK® 301
Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.

20-2180 Series
Potting & Encapsulating
Medium hardness polyurethane with excellent dielectric strength and low toxicity. Also available as faster gelling versions 20-2183 and 20-2184. Softer Shore A Hardness versions available as 20-2101, 20-2140, and 20-2160.

50-3141
Thermally Conductive
Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:! mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.

DP 240 / DP 340
FOIL MASTIC TAPE
A foil backed butyl mastic rolled sealant tape that is fully cured, high pressure/high velocity rated for use on commercial and residential supply and return air ducts. DP Foil Mastic Tape is pressure sensitive and requires no cure...

EPO-TEK® H67-MP
Thermally Conductive Adhesive
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

60-7185RCL
UV Curable
Low viscosity, clear UV aliphatic urethane acrylate for bonding, coating, or encapsulating.
EPO-TEK® 301
Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.
20-2180 Series
Potting & Encapsulating
Medium hardness polyurethane with excellent dielectric strength and low toxicity. Also available as faster gelling versions 20-2183 and 20-2184. Softer Shore A Hardness versions available as 20-2101, 20-2140, and 20-2160.
50-3141
Thermally Conductive
Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:! mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.
DP 240 / DP 340
FOIL MASTIC TAPE
A foil backed butyl mastic rolled sealant tape that is fully cured, high pressure/high velocity rated for use on commercial and residential supply and return air ducts. DP Foil Mastic Tape is pressure sensitive and requires no cure...
EPO-TEK® H67-MP
Thermally Conductive Adhesive
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.


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