Downloads
Related Products

50-3141FR
Flame Retardant Epoxy Adhesive
Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:1 mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.

CONVERGENT Pentra-Cure® (MH)
Concrete Cure, Hardener and Densifer
Pentra-Cure™ (MH) is an eco-friendly, all-in-one treatment that cures, hardens and densifies fresh concrete with one application. It provides long-term protection for commercial and industrial floors against heavy wear and abuse. This unique solution forms a membrane on...

EPO-TEK® H37-MP
Low Temperature Cure Epoxy
Low stress and low temperature cure temperature version of H35-175MP.

EPO-TEK® 301-2
Optically Transparent Epoxy Resin
Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics.

EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

DP SEAM SEALANT
Non Curing Seam Sealant
A non-curing, non-skinning, solvent based pumpable butyl injection seam sealant ideal for sealing seams in Pittsburgh, Button Punch, Snap Lock and roll formed seams. DP Seam Sealant is ideal for coil line applications.Non-curing and non-skinning.Permanently pliable.
50-3141FR
Flame Retardant Epoxy Adhesive
Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:1 mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.
CONVERGENT Pentra-Cure® (MH)
Concrete Cure, Hardener and Densifer
Pentra-Cure™ (MH) is an eco-friendly, all-in-one treatment that cures, hardens and densifies fresh concrete with one application. It provides long-term protection for commercial and industrial floors against heavy wear and abuse. This unique solution forms a membrane on...
EPO-TEK® H37-MP
Low Temperature Cure Epoxy
Low stress and low temperature cure temperature version of H35-175MP.
EPO-TEK® 301-2
Optically Transparent Epoxy Resin
Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics.
EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
DP SEAM SEALANT
Non Curing Seam Sealant
A non-curing, non-skinning, solvent based pumpable butyl injection seam sealant ideal for sealing seams in Pittsburgh, Button Punch, Snap Lock and roll formed seams. DP Seam Sealant is ideal for coil line applications.Non-curing and non-skinning.Permanently pliable.


Get in touch to learn more
Speak to us on 401-946-5564
Contact us














