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XD-CURE
Concrete Curing Compound and Sealer
XD-CURE is a clear, odorless, water-based concrete curing compound that is formulated to ensure proper concretestrength development, help prevent shrinkage cracks, and leave a bondable surface for further coatings, treatments or flooring materials.

50-2369FR
Flame Retardant Potting Urethane
Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.

CRACKBOND® JF
Polyurea Concrete Repair Joint Filler
This elastomeric, Polyurea joint filler (formerly known as JF-311) allows 10-15% movement of installed joint width and can be used in temperatures between -40 °F to 120 °F (-40 °C to 49 °C). Available in cartridges and in...

EPO-TEK® H67-MP
Thermally Conductive Epoxy
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

20-2362FR
Fire Retardant Urethane
Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.

20-3302
Ultra Clear Epoxy Resin for Adhesives & Sealants
Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.
XD-CURE
Concrete Curing Compound and Sealer
XD-CURE is a clear, odorless, water-based concrete curing compound that is formulated to ensure proper concretestrength development, help prevent shrinkage cracks, and leave a bondable surface for further coatings, treatments or flooring materials.
50-2369FR
Flame Retardant Potting Urethane
Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.
CRACKBOND® JF
Polyurea Concrete Repair Joint Filler
This elastomeric, Polyurea joint filler (formerly known as JF-311) allows 10-15% movement of installed joint width and can be used in temperatures between -40 °F to 120 °F (-40 °C to 49 °C). Available in cartridges and in...
EPO-TEK® H67-MP
Thermally Conductive Epoxy
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
20-2362FR
Fire Retardant Urethane
Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.
20-3302
Ultra Clear Epoxy Resin for Adhesives & Sealants
Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.


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