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EP-PATCH
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EP-PATCH is a three-component, high-performance, 100% solids, multi-purpose, non-shrink epoxy patching mortar. It is characterized by high early strength, low modulus, excellent workability and excellent bond strength. The system combines a high-quality epoxy resin and curing agent with an engineered blend of graded...

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ISO 10993 Biocompatible Shadow Cure Capable UV curing epoxy. A translucent cationic/epoxy UV with high viscosity, high Tg, and high strength.

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EP-PATCH
Higher-performance, low-modulus, epoxy patching mortar
EP-PATCH is a three-component, high-performance, 100% solids, multi-purpose, non-shrink epoxy patching mortar. It is characterized by high early strength, low modulus, excellent workability and excellent bond strength. The system combines a high-quality epoxy resin and curing agent with an engineered blend of graded...
EPO-TEK® MED-OG198-55
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ISO 10993 Biocompatible Shadow Cure Capable UV curing epoxy. A translucent cationic/epoxy UV with high viscosity, high Tg, and high strength.
DP 2502
Fiberglass Duct Liner Adhesive
A premium grade, water based, UL Classified duct liner adhesive specifically formulated for spray, brush, roller and coil line applications. It can be used to seal cut edges of fiberglass duct liner. DP 2502 can also be used...
CRACKBOND® V200 HI-MOD
Low Viscosity Epoxy Sealer
CRACKBOND® V200 HI-MOD is a two-component, moisture insensitive, high modulus, high strength epoxy healer/sealer deck penetrant, designed to prolong the life of concrete by sealing cracks against moisture and preventing chloride ion intrusion. The super-low viscosity (200 cP),...
DP 503 HIGH TEMP RED
100% RTV Silicone Sealant
A high-performance HVAC, industrial, commercial, and residential construction grade 100% Acetoxy RTV Silicone adhesive/sealant that can withstand extreme heat while maintaining its physical properties. DP 503 has excellent resistance to aging, weathering, and UV degradation and will provide...
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.


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