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EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
EPX50-SC
Low-Modulus, Epoxy Urethane Co-Polymer
EPX50‑SC (Standard Cure) is a moisture‑insensitive, low‑modulus epoxy urethane co‑polymer engineered to deliver dependable performance in demanding concrete preservation environments. Applied as a 1/4" to 3/8" single‑ or dual‑layer system, it forms a durable, chemical‑resistant, and waterproof protective...
ULTRABOND® EPX-3CC
High Performance Epoxy Anchor Adhesive
ULTRABOND® EPX-3CC is everything you need, and nothing you don’t, because it’s the perfect balance between high performance and high volume. With an installation temperature range of 48 °F to 108 °F, and a full cure in 4...
EP-PATCH 7040
High-performance, low-modulus, epoxy patching mortar
EP-PATCH 7040 is a three-component, high-performance, 100% solids, multi-purpose, non-shrink epoxy patching mortar. This low-modulus material offers excellent bond strength and outstanding workability, providing extended working times for higher temperature applications. The EP-PATCH 7040 system combines a high-quality epoxy resin and curing agent...
ULTRABOND® 1
Concrete Anchor Epoxy
Tried and true for more than 20 years, ULTRABOND 1 has numerous DOT approvals and is available in bulk and cartridge in a multitude of sizes with a 1:1 mix ratio that makes it much easier to use....
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