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Enhance®
Cutback Adhesive Encapsulator and Bond Promoter
Take your job site to the next level with Enhance. Its multi-functioning capabilities tackle many tough challenges such as detackifying or encapsulating existing adhesive residue, including cutback. Even difficult-to-bond substrates are no match for the textured surface profile...
EPO-TEK® HYB-353ND-HV
UV Hybrid Curing Epoxy
A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...
EPO-TEK® H67-MP
Thermally Conductive Epoxy
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
60-7155RCL
UV Curable Potting Epoxy Resin
Potting and adhesive UV resin with very low viscosity that passes ASTM E595 low outgassing.
XD-CURE
Concrete Curing Compound and Sealer
XD-CURE is a clear, odorless, water-based concrete curing compound that is formulated to ensure proper concretestrength development, help prevent shrinkage cracks, and leave a bondable surface for further coatings, treatments or flooring materials.
DP 3060
Low Viscosity Lagging Adhesive
A low viscosity, premium quality, UL Classified, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. The lower viscosity of DP 3060 makes it an ideal lap adhesive for pipe insulation...
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