EPO-TEK® H70S - Thermally Conductive Epoxy

Epo Tek H70e Main Product Carousel Image

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping 

SDS TDS
Where to buy
Brand:
Epoxy Technology
Technology:
Epoxy
Application:
Consumer Electronics and PCBA Datacom and Telecom E-mobility Microelectronics/Semiconductors Radar Systems, Navigation and Sensors
Market:
Aerospace and Defense Automotive and Transportation Electronics Optical, Datacom and Telecom
Function:
Bonding Encapsulation Thermal Transfer

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

Viewing options:
EPO-TEK® H67-MP

EPO-TEK® H67-MP

Thermally Conductive Epoxy

Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

SDS TDS
View product
EPO-TEK® T7109

EPO-TEK® T7109

Thermal Heatsink Adhesive

Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.

SDS
TDS
View product
EPO-TEK® 730

EPO-TEK® 730

Thixotropic Epoxy Adhesive

All purpose thixotropic and room temperature-curing epoxy adhesive.

SDS
TDS
View product
50-3170

50-3170

Thermally Conductive Epoxy Rubber Repair Adhesive

Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.

SDS
TDS
View product
EPO-TEK® EK1000

EPO-TEK® EK1000

Electrically Conductive Silver Filled Adhesive

High thermal conductive silver filled adhesive.

SDS TDS
View product
EPO-TEK® 301-2

EPO-TEK® 301-2

Optically Transparent Epoxy Resin

Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics. 

SDS
TDS
View product

Get in touch to learn more

Speak to us on 1-978-667-3805

Contact us