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EPO-TEK® H70S - Thermally Conductive Epoxy

Epo Tek H70e Main Product Carousel Image

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping

SDS TDS

Where to buy

Epo Tek H70e Main Product Carousel Image

Features

Heat-sinking adhesive
Excellent handling characteristics and the long pot life at room temperature for this unique, two component system is obtained without the use of solvents.
Can be cured very rapidly; excellent material to use for making fast circuit repairs; can be snap-cured for in-line semiconductor die-bonding.
Can be screen printed, machine dispensed, and stamped

Applications

Chip bonding in microelectronic and optoelectronics applications.
Fast circuit repairs
Snap-cured for in-line semiconductor die-bonding

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name H70S

File Size 555.7 KB

View

Safety Data Sheet

Document Name H70S

File Size 306.3 KB

View

Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Consumer Electronics and PCBA Datacom and Telecom E-mobility Microelectronics/Semiconductors Radar Systems, Navigation and Sensors

Market:

Aerospace and Defense Automotive and Transportation Electronics Optical, Datacom and Telecom

Function:

Bonding Encapsulation Thermal Transfer

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

Viewing options:

EPO-TEK® H37-MP

Low Temperature Cure Epoxy

Low stress and low temperature cure temperature version of H35-175MP.

SDS TDS

50-3152FR

Thermally Conductive Potting Epoxy

Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.

TDS

EPO-TEK® 930-4

Thermally Conductive Epoxy Adhesive

Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.

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ASI COMPOUND 70

Multi-Purpose Silicone Grease and Lubricant

ASI Compound 70 Multi-Purpose Silicone Grease is a moisture resistant, non-curing paste which retains its consistency and properties over a temperature range of -70°F to 400°F.This stiff, tacky compound is non-melting and retains its properties over extended periods...

SDS

60-7111RCL

UV Curable Urethane Adhesive & Encapsulant

Non-yellowing UV urethane adhesive and encapsulant.

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50-3141FR

Flame Retardant Epoxy Adhesive

Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:1 mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.

TDS

Get in touch to learn more

Speak to us on 1-978-667-3805