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EPO-TEK® H20E-MP
Electrically Conductive Silver Epoxy
Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.
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High Velocity Duct Sealant
A UL Listed, Low VOC, smooth, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1015 allows for better coverage and ease of application. It exceeds...
EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
ASI 505
Industrial Grade Silicone Self Leveling
ASI 505 Self-Leveling RTV Silicone is a one-component, moisture cure, flowable material designed for a variety of potting, coating, sealing and waterproofing applications.Once applied, ASI 505 will begin skinning in 8 minutes and continue curing to form a...
CONVERGENT Pentra-Sil® (H)
Lithium Densifier for Large Format Warehouses and Data Centers
Pentra-Sil® (H) provides efficient and economic maximum densification for large format industrial warehouses and data centers. This lithium silicate “time of placement” reactive densifier significantly reduces wear due to abrasion while eliminating concrete dusting, and makes the surface...
EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.
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