Downloads
Technical Data Sheet
Related Products
EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
DP 1010
Water Based Duct Sealant
A premium grade, UL Listed, Low VOC, smooth, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1010 allows for better coverage and ease of application....
EP75-SEAL
Penetrating Healer and Urethane Sealer
EP75-SEAL is a highly penetrating, two-component epoxy healer/sealer. Its rapid cure time allows traffic to re-open in less than six hours.
EPO-TEK® H20S
Silver Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.
ACCU-CHOCK
Ultimate Strength Epoxy
ACCU-CHOCK is a two-component, high-performance, high early and ultimate strength epoxy machine chock for use in high bearing areas with negligible shrinkage and creep, fast cure and excellent flowability. If you have any more questions about Adhesives Technology...
20-3060
Impact Resistant Epoxy
Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.
Get in touch to learn more
Speak to us on 401-946-5564
Contact us