Downloads
Technical Data Sheet
Certifications
Related Products
CRACKBOND® EPOXY REPAIR PASTE
Epoxy Repair Paste
Two component, moisture insensitive, high modulus, epoxy paste available in cartridges and bulk kits. Ideal as a bonding agent, filler, capping material for crack injection or as a pick-proof sealant.
Emulsion Adhesives
Evans Adhesive's emulsion adhesives deliver versatile, high-performance bonding solutions, offering strong, reliable adhesion and flexibility for a wide range of industrial and packaging needs.
XD-CURE
Concrete Curing Compound and Sealer
XD-CURE is a clear, odorless, water-based concrete curing compound that is formulated to ensure proper concretestrength development, help prevent shrinkage cracks, and leave a bondable surface for further coatings, treatments or flooring materials.
EPO-TEK® H65-175MP
Thermally Conductive Epoxy
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.
DP 40
Butyl Joint Sealant
A skinning, permanently flexible butyl joint sealant that is ideal for low and high temperature insulation applications. DP 40 is recommended to seal joints in cellular foam glass and remains flexible to -70° F. DP 40 acts as...
EP50-OVERLAY
Low Modulus Polymer Resin Overlay
EP50-OVERLAY is a solvent-free, moisture-insensitive, 100% solids, low-modulus, two-component polymer designed primarily for bonding skid-resistant overlays.
Get in touch to learn more
Speak to us on 401-946-5564
Contact us