Related Products

HFP 1:1
Advanced Surface Polymer
HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.

EPO-TEK® HYB-353ND-LV
Low Viscosity UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...

Dextrin Adhesives
Evans Adhesive dextrin products provide high-performance bonding for packaging, labeling, and paper converting. Known for their versatility, they offer consistent adhesion and easy application across a range of industrial uses.

EPO-TEK® H20S
Silver Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic

EP-MV
Medium Viscosity Concrete Bonding Adhesive
EP-MV is a 100% solids, two-component, high-modulus, medium-viscosity, moisture-insensitive structural epoxy adhesive designed for bonding freshly mixed concrete to hardened concrete, for bonding hardened concrete to hardened concrete and other materials, and as a binder for epoxy mortars....
HFP 1:1
Advanced Surface Polymer
HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.
EPO-TEK® HYB-353ND-LV
Low Viscosity UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...
Dextrin Adhesives
Evans Adhesive dextrin products provide high-performance bonding for packaging, labeling, and paper converting. Known for their versatility, they offer consistent adhesion and easy application across a range of industrial uses.
EPO-TEK® H20S
Silver Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic
SEALANT CHIP BRUSHES
Sealant Chip Brushes
Available in 2" and 3" sizes
EP-MV
Medium Viscosity Concrete Bonding Adhesive
EP-MV is a 100% solids, two-component, high-modulus, medium-viscosity, moisture-insensitive structural epoxy adhesive designed for bonding freshly mixed concrete to hardened concrete, for bonding hardened concrete to hardened concrete and other materials, and as a binder for epoxy mortars....


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