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ULTRABOND® HS-1CC
High Strength Anchoring Epoxy
NSF/ANSI 61 & 372 CertifiedULTRABOND® HS-1CC is the world’s first anchoring epoxy formulated to be IBC/IRC compliant in both bulk and cartridge delivery systems. For use in dry, damp, water-filled and submerged applications, even in the most extreme...

PILE ANCHOR GROUT
Fast-strength, fast-setting epoxy anchoring grout
PILE ANCHOR GROUT is a two-component, 100% solids, high strength, pourable epoxy anchoring grout.

50-3112
Fast Curing Epoxy Adhesive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.

EP100-SEAL
Epoxy Concrete Healer/Sealer
EP100-SEAL is a highly penetrating, two-component epoxy healer/sealer. Its rapid cure time allows traffic to re-open in less than six hours.

EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.

EPO-TEK® MED-314
Biocompatible/ High Temperature Transparent Epoxy
ISO 10993-5 biocompatible, clear, and colorless optical-grade epoxy with low viscosity.
ULTRABOND® HS-1CC
High Strength Anchoring Epoxy
NSF/ANSI 61 & 372 CertifiedULTRABOND® HS-1CC is the world’s first anchoring epoxy formulated to be IBC/IRC compliant in both bulk and cartridge delivery systems. For use in dry, damp, water-filled and submerged applications, even in the most extreme...
PILE ANCHOR GROUT
Fast-strength, fast-setting epoxy anchoring grout
PILE ANCHOR GROUT is a two-component, 100% solids, high strength, pourable epoxy anchoring grout.
50-3112
Fast Curing Epoxy Adhesive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.
EP100-SEAL
Epoxy Concrete Healer/Sealer
EP100-SEAL is a highly penetrating, two-component epoxy healer/sealer. Its rapid cure time allows traffic to re-open in less than six hours.
EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.


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