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High Strength Bonding Epoxy
5-minute set, high bond strength epoxy ideal for on field repairs. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3020 series (20 minute set) and the 10-3046 series (46 minute set).

UV Curable Urethane Adhesive & Encapsulant
Non-yellowing UV urethane adhesive and encapsulant.

Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.

UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

Low Outgassing Silver Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.

Low Outgassing Optical Epoxy
High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.
High Strength Bonding Epoxy
5-minute set, high bond strength epoxy ideal for on field repairs. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3020 series (20 minute set) and the 10-3046 series (46 minute set).
UV Curable Urethane Adhesive & Encapsulant
Non-yellowing UV urethane adhesive and encapsulant.
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
Low Outgassing Silver Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.


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