Features
- Exceptional thermal and electrically conductivity
- Low viscosity and smooth thixotropic paste silver filled epoxy (thixotropic 3.6)
- Thermal conductivity up to 35.5 W/mK at recommended curing schedule
- Storage modulus of 273,528 psi
- Versatile in processing/ application techniques
Applications
- Concentrator PV solar cell chip attach
- Thermal management for heat generate chip or components
- High brightness LED die attach
- Available in a MIL-STD_883 Test Method 5011 version - EK1000-MP for demanding military applications
Downloads
Certifications

Available Packaging
Notes
Contact our customer service or sales representative for more information.
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EPO-TEK® EK1000
Conductive Silver Filled AdhesiveLet's talk
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