50-3186
Very High Temperature Resistant Epoxy Adhesive
50-3186NC is a two-part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186NC is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature...
50-3253
Flame Retardant Thermally Conductive Epoxy Resin
50-3253FR Potting and Encapsulating Compound has been formulated to meet the stringent nonburning requirements of UL 94 V-0. This medium viscosity system offers high thermal conductivity, low shrinkage, low exotherm, and outstanding electrical insulation properties.
60-7105
UV Curable Adhesive, Coating & Potting Compound
UV Cure 60-7105 is a low viscosity urethane adhesive, coating and potting compound. This UV curable resin exhibits outstanding adhesion, toughness, and exterior durability. This material is a good choice for deep section curing.
60-7107RTR
Electronic Epoxy Adhesive
Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.
60-7108RCL
Non-Yellowing Adhesive UV Compound
60-7108RCL is a low viscosity and optically clear UV curable system. It is designed for fiber optic and other clear adhesive or potting applications. 60-7108RCL is a good choice for electronic assemblies due to its electrical insulation properties...
60-7111RCL
UV Curable Urethane Adhesive & Encapsulant
Non-yellowing UV urethane adhesive and encapsulant.
60-7112RCL
Electronic UV Adhesive & Encapsulant
UV Cure 60-7112RCL is a higher viscosity version of the 60-7111RCL.
60-7155RCL
UV Curable Potting Epoxy Resin
Potting and adhesive UV resin with very low viscosity that passes ASTM E595 low outgassing.
60-7156
Flexible UV Curable Adhesive & Potting Compound
UV 60-7156 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. Its low durometer (flexibility) provides less stress on sensitive electronic components. UV Cure 60-7156...
