Certifications
Related Products

20-2175
Thixotropic Polyurethane Encapsulant
Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.

CRACKBOND® JF-82 FAST
Fast Cure Polyurea Joint Filler
Rapid curing, polyurea control joint filler designed for heavy duty traffic and freezer applications. Low viscosity, self leveling and allows for 10-15% movement of installed joint width. Available in cartridges and bulk.

TRANSIL® 244(+)
Densifying Waterproofer and Chloride Ion Barrier
Transil® 244(+) is a premium Nano-Lithium® hardener, densifier, and hydrophobic sealer ideal for protecting concrete and masonry surfaces against damage from freeze-thaw cycles, moisture, and chloride ion intrusion.

50-3152FR
Thermally Conductive Potting Epoxy
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.

EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.

CONVERGENT Pentra-Sil® (H)
Lithium Densifier for Large Format Warehouses and Data Centers
Pentra-Sil® (H) provides efficient and economic maximum densification for large format industrial warehouses and data centers. This lithium silicate “time of placement” reactive densifier significantly reduces wear due to abrasion while eliminating concrete dusting, and makes the surface...
20-2175
Thixotropic Polyurethane Encapsulant
Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.
CRACKBOND® JF-82 FAST
Fast Cure Polyurea Joint Filler
Rapid curing, polyurea control joint filler designed for heavy duty traffic and freezer applications. Low viscosity, self leveling and allows for 10-15% movement of installed joint width. Available in cartridges and bulk.
TRANSIL® 244(+)
Densifying Waterproofer and Chloride Ion Barrier
Transil® 244(+) is a premium Nano-Lithium® hardener, densifier, and hydrophobic sealer ideal for protecting concrete and masonry surfaces against damage from freeze-thaw cycles, moisture, and chloride ion intrusion.
50-3152FR
Thermally Conductive Potting Epoxy
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.
EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
CONVERGENT Pentra-Sil® (H)
Lithium Densifier for Large Format Warehouses and Data Centers
Pentra-Sil® (H) provides efficient and economic maximum densification for large format industrial warehouses and data centers. This lithium silicate “time of placement” reactive densifier significantly reduces wear due to abrasion while eliminating concrete dusting, and makes the surface...


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