10-3004NC
Low Viscosity, Adjustable Flexibility Epoxy Adhesive
10-3004NC is a high bond strength epoxy adhesive, with a non-critical mix ratio and adjustable flexibility. 10-3004NC yields high peel strength and excellent tensile strength. It also has outstanding thermal shock, impact and vibration resistance. This high-performance epoxy...
10-3005 Series
High Strength Bonding Epoxy
5-minute set, high bond strength epoxy ideal for on field repairs. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3020 series (20 minute set) and the 10-3046 series (46 minute set).
10-3006
Non-Sag Patch & Repair Epoxy System
10-3006 is a non-sag fast setting patch & repair epoxy system and is dry to the touch in 5-10 minutes.
10-3009NC
Low Viscosity Epoxy Adhesive & Potting Compound
10-3009 NC is a low viscosity epoxy adhesive and potting compound. This product offers a good combination of peel and tensile strength. 10-3009 NC provides electrical insulation and outstanding adhesion.
10-3020
Fast Cure Thixotropic Epoxy Adhesive
10-3020 is part of the 10-3005 series and is a high bond strength adhesive. 10-3020 has a quick setting time of 20 minutes at room temperature. It is excellent for bonding plated metals, glass, wood, ceramic, felt, cement,...
10-3022
Epoxy SMT Stencil Assembly Adhesive
10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance.
10-3026
Fast Setting Epoxy Adhesive & Encapsulant
10-3026 is a clear, fast setting adhesive and encapsulant with a good dielectric strength ideal for small electronic potting and encapsulating.
10-3033
Room Temperature Cure Epoxy Adhesive
Room temperature cure adhesive that meets FDA regulations permitting use in "indirect" food contact applications.
10-3040
Chemical Resistant Epoxy Adhesive
Two component chemical resistance epoxy adhesive system. Developed for potting, coating, and adhesive applications requiring superior chemical resistance. Contains solid glass spheres for the purpose of controlling bond thickness. Available in dual barrel Triggerbond cartridges.
