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246 matches
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10-3004NC

Low Viscosity, Adjustable Flexibility Epoxy Adhesive

10-3004NC is a high bond strength epoxy adhesive, with a non-critical mix ratio and adjustable flexibility.  10-3004NC yields high peel strength and excellent tensile strength. It also has outstanding thermal shock, impact and vibration resistance. This high-performance epoxy...

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10-3005 Series

10-3005 Series

High Strength Bonding Epoxy

5-minute set, high bond strength epoxy ideal for on field repairs. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3020 series (20 minute set) and the 10-3046 series (46 minute set).

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10-3006

Non-Sag Patch & Repair Epoxy System

 10-3006 is a non-sag fast setting patch & repair epoxy system and is dry to the touch in 5-10 minutes. 

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10-3009NC

Low Viscosity Epoxy Adhesive & Potting Compound

10-3009 NC is a low viscosity epoxy adhesive and potting compound. This product offers a good combination of peel and tensile strength. 10-3009 NC provides electrical insulation and outstanding adhesion.

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10-3012

Fast Setting Epoxy Adhesive

10-3012 is a high strength, fast setting epoxy adhesive. This epoxy adhesive and potting compound is specially formulated for high clarity, good impact strength and water resistance

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10-3020

Fast Cure Thixotropic Epoxy Adhesive

10-3020 is part of the 10-3005 series and is a high bond strength adhesive. 10-3020 has a quick setting time of 20 minutes at room temperature.  It is excellent for bonding plated metals, glass, wood, ceramic, felt, cement,...

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10-3022

Epoxy SMT Stencil Assembly Adhesive

 10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 

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10-3026

Fast Setting Epoxy Adhesive & Encapsulant

10-3026 is a clear, fast setting adhesive and encapsulant with a good dielectric strength ideal for small electronic potting and encapsulating.

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10-3033

Room Temperature Cure Epoxy Adhesive

Room temperature cure adhesive that meets FDA regulations permitting use in "indirect" food contact applications.

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