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50-3152FR
Thermally Conductive
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.
10-3005 Series
Adhesives & Sealants
5-minute set, high bond strength epoxy ideal for on field repairs. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3020 series (20 minute set) and the 10-3046 series (46 minute set).
EPO-TEK® T7110
Thermally Conductive Adhesive
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.
20-3060
Potting & Encapsulating
Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.
50-3170
Thermally Conductive
Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.
70-3812NC
Thermally Conductive
Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.
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