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EPO-TEK® OG198-54
UV Curable Epoxy
Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.
SDS
TDS
EPO-TEK® OM118
Nonconductive Epoxy Adhesive
Two component, optically clear, electrically and thermally insulating epoxy designed for adhesive, sealing, and encapsulation applications found in semiconductor, medical, filtration, and scientific/OEM industries. It is a slightly higher viscosity and Tg alternative to EPO-TEK® 301.
EPO-TEK® UD1214
Dual UV-Thermally Curing Epoxy
Optically opaque, UV hybrid epoxy. It is especially designed for UV fast cure and following low temperature (< 80C) curing for shadow areas. It can be used as adhesive, sealing and encapsulation in semiconductor, electro-optics, fiber optics, circuit...
