EPO-TEK® OM118 - Nonconductive Epoxy Adhesive

A premium grade, UL Listed, Low VOC, smooth, water based, UL Listed, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. DP 1010 Spray is specially formulated for application by airless sprayers...

Smooth, non-sag, non-abrasive consistency ideal for use in bulk dispensing systems without adverse wear on pumps. Extensive DOT approvals. Available in cartridges and bulk with ATC. 

Rapid curing, polyurea control joint filler designed for heavy duty traffic and freezer applications. Low viscosity, self leveling and allows for 10-15% movement of installed joint width. Available in cartridges and bulk. 

Highly thixotropic epoxy with non-flowing properties and high temperature resistance.

Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. 

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping