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Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.
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EPO-TEK® H20S
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100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.
CONVERGENT SlabArmor™ Closer
Colloidal Silica Concrete Densifier/Hardener
SlabArmor™ Closer is the second step in the SlabArmor system. This colloidal silica densifier/hardener is applied after power troweling has been completed. A single application is applied to the surface and requires no scrubbing or rinsing. Its reactive...
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Fast Curing Epoxy Adhesive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.


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