EPO-TEK® OM118 - Nonconductive Epoxy Adhesive

A premium grade, UL Listed, Low VOC, smooth, water based, UL Listed, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. DP 1010 Spray is specially formulated for application by airless sprayers...

ASF-GEL is a two-component, styrene-free, epoxy acrylate adhesive gel with an extended installation range from 15°F to 95°F.

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. 

ISO 10993 biocompatible electrically conductive (ECA) silver-filled epoxy with electrical and high thermal conductivity. It is a well characterized and relied upon ECA, with over 40 years of successful design use. 

Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy.