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EPO-TEK® 301

EPO-TEK® 301

Low Viscosity Optical Grade Epoxy

Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.

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EPO-TEK® 320

EPO-TEK® 320

Thixotropic Optical Epoxy Adhesive

Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy. 

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EPO-TEK® 730-110

EPO-TEK® 730-110

Thermally and Electrically Insulating Epoxy

Room temperature-curing, thermally and electrically insulating epoxy.

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EPO-TEK® MED-301

EPO-TEK® MED-301

Low Viscosity Medical Grade Epoxy

ISO 10993 Medical grade low viscosity clear epoxy with high spectral transmission. 

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EPO-TEK® MED-301-2

EPO-TEK® MED-301-2

Optically Transparrent Medical Grade Epoxy Resin

ISO 10993 Tested/Fully Compliant, Clear and colorless, Low viscosity, room temperature curing epoxy.

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EPO-TEK® MED-T7110

EPO-TEK® MED-T7110

Medical Grade Thermally Conductive Epoxy

ISO 10993 Medical grade thermally conductive epoxy, electrically insulating, low temperature curing epoxy. Ideal for temperature sensitive devices.  

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EPO-TEK® OE121

EPO-TEK® OE121

Underfill Epoxy Adhesive

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

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EPO-TEK® OE121 Black

EPO-TEK® OE121 Black

Underfill Epoxy Adhesive

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

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EPO-TEK® OG116-31

EPO-TEK® OG116-31

UV Epoxy Encapsulant

Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

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