EPO-TEK® OE121 - Underfill Epoxy Adhesive

Oe121 01

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used for general potting and encapsulation. 

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Brand:
Epoxy Technology
Technology:
Epoxy
Application:
Microelectronics/Semiconductors Optical Sensors and Camera Modules
Market:
Electronics Optical, Datacom and Telecom
Function:
Encapsulation Potting Potting and Encapsulation Underfill

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

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