Features
- Non-Corrosive, Electronic Grade
- Heat & Cold Resistant
- Excellent Electrical Properties
- Long-Lasting Durability
- Resistant To Some Chemicals
- Good Stress Relieving Properties
- Excellent For Bonding, Sealing, or Encapsulating
- Advanced Adhesion To Various Substrates
Benefits
- 100% Silicone
- Broad Adhesion Range/Bonds to Common Substrates
- Chemical Resistant
- Color Stable
- Compatible with Electronics
- Excellent for Encapsulating/Sealing/Coating
- High Temperature Resistance
- Highly Flexibile/Allows for Movement
- Long Life
- Low Odor
- Low Temperature Resistance
- Moisture Curing
- Mold and Mildew Resistant
- Non-Melting
- Non-Slump – Overhead/Vertical Applications
- Non-Yellowing
- One-Component
- RTV
- Self-Leveling
- Solvent-Free
- UV Resistant/Degredation
- VOC Compliant
- Water Repellant
- Weather Resistant
- Will Not Crack
- Withstands Extreme Temperatures
Properties
- *Intermittent temperature up to 450°F. Strength will start to develop immediately and continue increasing for 7 days after application. ASI recommends testing strength and adhesion on the 7th day. ASI 388 suggested application temperature range: -35°F to 150°F. Testing should be done to confirm temperature requirements are met. Information on this data sheet can change without notice and it is therefore not recommended that these figures be used in spec writing. If you have any questions contact manufacturer‘s sales and technical service department.
Substrates
- Glass
- Most Metals
- Most Fiberglass
- Most Wood Types
- Aluminum
- Porous Surfaces
- Vinyl
- Rubber
- Natural & Synthetic Fiber
- Most Painted Surfaces
- Some Plastics
Downloads
Certifications

- UL Recognized
- VOC Compliant (21 grams/liter ASTM D2369)
- Meets the requirements of MIL 46106B Type 1
Additional information
ADDITIONAL COMMON APPLICATIONS
- Sealing Lead Wire Entries
- Waterproofing Electronics
- Component Mounting
- Covering Sensitive Components
- Sealing Electronic Assemblies
- Adhering Electronics
- Sealing/Bonding Electronics
- Circuit Board Protection
- Electronic Encapsulating
- Electrical Connections
- Telecommunications Including Coaxial Cable Connectors, Etc.
- Engine Components
- General Industrial Applications
Available Packaging
Notes
ASI 388 is stocked in cartridges, 2.8 oz. squeeze tubes, pails and drums. Additional packaging may be available upon request. Inquire to ASI sales staff for additional information.
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Hot Melt Adhesives
Evans Adhesive's hot melt adhesives provide fast-setting, durable bonds for packaging and converting industries, offering reliable performance, efficient application, and strong adhesion to meet the demands of high-volume production environments.
EPO-TEK® 730
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All purpose thixotropic and room temperature-curing epoxy adhesive.
50-2369FR
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Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.
50-3152FR
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Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.


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