Enhance® Cutback Adhesive Encapsulator and Bond Promoter

Features

RH
90%

PH
NTR 5-14

MVER
8 lbs

Cure Time
1-2 hrs

1-coat application
1-part product
1-step application
Antimicrobial technology (Made with Meta-Sept™ anti-microbial agents that will provide its wet and dry films with protection from fungal growth. This protection is determined using the ASTM G21 test method.)
Bond promoter
Detackifies existing adhesive residue
Easy application (roller applied)
Encapsulates cutback residue
Fast roller application
Fast-drying formula
Highly bondable, textured membrane
Hybrid Propel™ technology
Isocyanate-free
LEED v4 contributing: CDPH v1.2
Modified urethane (isocyanate-free)
Moisture tolerance
Primes difficult-to-bond substrates
Advantech®, ceramic tile, existing vinyl
Primes Sahara® for glue-down applications
Protects flooring from alkali attack
Rapid cure time
Seals porous substrates
Solvent-free
Low VOCs

Substrates

Downloads

Type

Document Name

File Size

Miscellaneous

Document Name Enhance® Warranty Sheet

File Size 222.7 KB

View

Safety Data Sheet

Document Name Enhance® SDS

File Size 138.0 KB

View

Technical Data Sheet

Document Name Enhance® TDS

File Size 293.6 KB

View

Certifications

Brand:

Taylor Adhesives

Technology:

Silane Modified

Application:

Flooring Adhesives

Market:

Building Construction

Flooring Categories:

Specialty

Available Packaging

Size

Part Number

Quantity

Picture

Size 2 Gallon

Part Number Plastic Pail with Plastic Lid and Metal Handle

Quantity 1

Picture

Related Products

Viewing options:

50-3170

Thermally Conductive

Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.

TDS

EPO-TEK® H37-MP

Electrically & Thermally Conductive Epoxy

Low stress and low temperature cure temperature version of H35-175MP.

ASI 504

Multi-Purpose RTV Silicone

ASI 504 Multi-Purpose Silicone can be used as both a sealant and adhesive for a variety of applications requiring a waterproof seal. It Is a paste-like, one component acetoxy silicone that cures to form a durable solid rubber...

TDS

60-7185RCL

UV Curable

Low viscosity, clear UV aliphatic urethane acrylate for bonding, coating, or encapsulating.

SDS TDS

EPX50-OVERLAY

Polymer Resin

Moisture-insensitive, low-modulus epoxy-urethane co-polymer overlay resin.

TDS

ASI 5900

Fast-Grab Hybrid Adhesive

ASI 5900 Fast Grab Hybrid Adhesive uses ASI’s innovative hybrid technology to develop immediate green strength to fixture substrates while the adhesive cures and provides a long-term, durable bond. ASI 5900 is 100% solids.It will not shrink and...

Get in touch to learn more

Speak to us on 800-868-4583

Enhance® - Surface Bond Promoter and Encapsulator

Features

Substrates

Downloads

Certifications

Available Packaging

Related Products