Features
- UL 94 V-0 Listed
- Low mix viscosity
- Low shrinkage
- Low exotherm
- Moisture Resistant
Applications
- Potting of sensitive electronic components part of a UL 94 rated system
Related Products

50-3170
Thermally Conductive Epoxy Rubber Repair Adhesive
Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.

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50-3152FR
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Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.
50-3170
Thermally Conductive Epoxy Rubber Repair Adhesive
Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.
20-2175
Thixotropic Polyurethane Encapsulant
Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.
EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
EPO-TEK® 730
Thixotropic Epoxy Adhesive
All purpose thixotropic and room temperature-curing epoxy adhesive.
20-3302
Ultra Clear Epoxy Resin for Adhesives & Sealants
Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.
50-3152FR
Thermally Conductive Potting Epoxy
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.


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