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ASI 388
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ASI 388 Electronic Grade RTV Silicone is a one part, moisture cure sealant that cures to form a tough, durable, flexible rubber that is deal for bonding, sealing, encapsulating and protecting electronic parts.Once cured, ASI 388 will withstand...
EPO-TEK® OE121
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Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
10-3003 Series
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Versatile variable mix ratio epoxy with high peel strength and outstanding thermal shock, impact, and vibration resistance. Available in regular, non sag, and high viscosities.
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Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.
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100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.
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