EPO-TEK® 301-2FL-MR - Optical Epoxy

High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications. 

Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.

ISO 10993 Medical grade thermally conductive epoxy, electrically insulating, low temperature curing epoxy. Ideal for temperature sensitive devices.  

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

CRACKBOND® V200 HI-MOD is a two-component, moisture insensitive, high modulus, high strength epoxy healer/sealer deck penetrant, designed to prolong the life of concrete by sealing cracks against moisture and preventing chloride ion intrusion. The super-low viscosity (200 cP),...

EP75-SEAL is a highly penetrating, two-component epoxy healer/sealer. Its rapid cure time allows traffic to re-open in less than six hours.