EPO-TEK® 301-2FL-T - Optical Epoxy

Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

100% solids, semi-rigid, epoxy joint filler.

A UL Listed, Low VOC, fiber reinforced, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1030 allows for easier sealing of holes and gaps often...

For cracked and uncracked concrete, ULTRABOND® HYB-2CC is IBC approved for application in temperatures down to 23 °F. And for jobs where a quick cure rate is required, it will cure completely in 30 minutes at 70 °F. Approved...

Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.