EPO-TEK® 375 - High Temperature Optical Epoxy

100% solids, semi-rigid, epoxy joint filler.

In the realm of multi-functioning wood adhesives, Ironwood nails it. Through its stable, cross-linking chemistry, Ironwood ensures that your flooring stays where you want it. Capable of managing moisture from most concrete slabs, Ironwood is also resistant to...

Low stress and low temperature cure temperature version of H35-175MP.

HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.

Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.

2055 provides quick grab with fast suction and holding power for the interior installation of all non-vinyl-backed carpet in direct glue-down and double-stick installations.