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725
Web Spray Adhesive
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EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
EPO-TEK® 343ND-LH
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Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND
EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping
DP 2510 – Black / DP 2515 – White
Fiberglass Protective Coating
A UL Classified coating for repairing and encapsulating damaged fiberglass insulation and line set protection from UV degradation. DP 2510/2515 provides a flexible, durable coating which helps to prevent fibers from entering the air stream. It may also...


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High Temperature Optical EpoxyLet's talk
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