EPO-TEK® EE178-9 - Electrically Conductive Adhesive

A two component, electrically conductive epoxy adhesive designed for semiconductor, hybrid, PCB and optoelectronic assemblies. It was designed for precision dispensing or stamping of small dot arrays, in ultra fine pitch applications such as connectors to flex-PCB, SMD or flip chip bonding. It is a fast curing, thixotropic paste with low bleed out.

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