EPO-TEK® EJ2312 - Room Temperature Curing ECA

50-3152FR

Thermally Conductive Potting Epoxy

Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.

EP-PATCH 7040

High-performance, low-modulus, epoxy patching mortar

EP-PATCH 7040 is a three-component, high-performance, 100% solids, multi-purpose, non-shrink epoxy patching mortar. This low-modulus material offers excellent bond strength and outstanding workability, providing extended working times for higher temperature applications. The EP-PATCH 7040 system combines a high-quality epoxy resin and curing agent...

Dextrin Adhesives

Evans Adhesive dextrin products provide high-performance bonding for packaging, labeling, and paper converting. Known for their versatility, they offer consistent adhesion and easy application across a range of industrial uses.

EPO-TEK® H67-MP

Thermally Conductive Epoxy

Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

EPO-TEK® H37-MP

Low Temperature Cure Epoxy

Low stress and low temperature cure temperature version of H35-175MP.

EPX50-RC

Fast-Setting, Low-Modulus, Epoxy Urethane Co-Polymer

EPX50-RC (Rapid Cure) delivers fast, high-strength performance for demanding infrastructure applications. This moisture-insensitive epoxy-urethane overlay meets ASTM C881 / AASHTO M235 Type III and forms a durable, waterproof, anti-skid surface ideal for bridge decks, elevated slabs, and high-friction...