EPO-TEK® H20E-D - Electrically Conductive Adhesive

SlabArmor™ Starter is the original colloidal silica curing/finishing aid for concrete developed in 2009, whose popularity has skyrocketed more recently with the growing use of “thirsty” low-carbon concrete using Type- 1L cement. In addition to being an excellent...

All purpose thixotropic and room temperature-curing epoxy adhesive.

A premium grade, UL Listed, Low VOC, smooth, water based, UL Listed, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. DP 1010 Spray is specially formulated for application by airless sprayers...

Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. 

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.

A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...