Features
- ≥ 100⁰C glass transition temperature
- Smooth thixotropic paste ( 22,000-28,000cps, Thixo 4.0)
- ≥ 10kg die shear strength
- MIL-STD 883/5011 and NASA ASTM E595 low outgassing epoxy
Applications
- Optoelectronics packaging
- Hybrid microelectronics
- Semiconductor IC packaging : die attach
- GaAs, LEDs, diodes chip attach
- Military applications
Certifications


- ASTM E595
Available Packaging
Notes
Contact our customer service or sales representative for more information.
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