EPO-TEK® H35-175MPLV - Silver Conductive Epoxy

Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND

Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. 

For cracked and uncracked concrete, ULTRABOND® HYB-2CC is IBC approved for application in temperatures down to 23 °F. And for jobs where a quick cure rate is required, it will cure completely in 30 minutes at 70 °F. Approved...

ASI 504 Multi-Purpose Silicone can be used as both a sealant and adhesive for a variety of applications requiring a waterproof seal. It Is a paste-like, one component acetoxy silicone that cures to form a durable solid rubber...