EPO-TEK® H35-175MPT - Silver Conductive Epoxy

Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. 

EPX50-RC (Rapid Cure) delivers fast, high-strength performance for demanding infrastructure applications. This moisture-insensitive epoxy-urethane overlay meets ASTM C881 / AASHTO M235 Type III and forms a durable, waterproof, anti-skid surface ideal for bridge decks, elevated slabs, and high-friction...

Rapid curing, polyurea control joint filler designed for heavy duty traffic and freezer applications. Low viscosity, self leveling and allows for 10-15% movement of installed joint width. Available in cartridges and bulk. 

Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.

Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.

Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.