Certifications
Related Products

2590 / 2595 HOSES
Foam Adhesive Canister Hoses
Hoses for DP 2590 Duct Liner Adhesive and DP 2595 Closed Cell Foam Adhesive canisters. AVAILABLE IN 12 FT. LENGTHS.

EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.

EPO-TEK® 301
Low Viscosity Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.

DP 502
100% RTV Silicone Sealant
A high-performance HVAC, industrial, commercial, and residential construction grade 100% Acetoxy RTV Silicone adhesive/sealant that is UL and NSF Recognized. It has excellent resistance to aging, weathering, and UV degradation. DP 502 will provide long term performance on...

EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.

EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
2590 / 2595 HOSES
Foam Adhesive Canister Hoses
Hoses for DP 2590 Duct Liner Adhesive and DP 2595 Closed Cell Foam Adhesive canisters. AVAILABLE IN 12 FT. LENGTHS.
EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
EPO-TEK® 301
Low Viscosity Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.
DP 502
100% RTV Silicone Sealant
A high-performance HVAC, industrial, commercial, and residential construction grade 100% Acetoxy RTV Silicone adhesive/sealant that is UL and NSF Recognized. It has excellent resistance to aging, weathering, and UV degradation. DP 502 will provide long term performance on...
EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...


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