EPO-TEK® H77

EPO-TEK® H77 Thermally Conductive, Electrically Insulating Epoxy

Designed for lid sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases, or ceramic.

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Safety Data Sheet

Document Name EPO-TEK® H77

File Size 322.6 KB

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Technical Data Sheet

Document Name EPO-TEK® H77

File Size 557.0 KB

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Brand:

Epoxy Technology

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