EPO-TEK® OD1001 - Thermally Conductive Epoxy

A premium quality, ZERO VOC, 100% solids, UL Classified, high pressure/high velocity butyl gasket tape for commercial and residential supply and return air duct uses. DP 1040 provides a flexible seal between TDC, TDF and applied flange connections...

Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.

Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.

Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe. 

Highly thixotropic epoxy with non-flowing properties and high temperature resistance. 

SlabArmor™ Closer is the second step in the SlabArmor system. This colloidal silica densifier/hardener is applied after power troweling has been completed. A single application is applied to the surface and requires no scrubbing or rinsing. Its reactive...