EPO-TEK® OD1001 - Thermally Conductive Epoxy

Water resistant, room temperature cure adhesive that meets FDA regulations Sections 175.105 and 175.300 permitting use in "indirect" food contact applications.

High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications. 

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. 

All purpose thixotropic and room temperature-curing epoxy adhesive.

Low stress and low temperature cure temperature version of H35-175MP.

THE CRACKER® is a non-explosive cracking agent enabling standard demolition to be carried out with comparative accuracy. This system is virtually noiseless, vibration free and is ecologically friendly. Break Concrete With Concrete Demolition Powder-The Cracker