EPO-TEK® OD1361 - Underfill Epoxy

Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications.  Fiber optic adhesive designed to meet Telecordia 1221.

EPX50‑SC (Standard Cure) is a moisture‑insensitive, low‑modulus epoxy urethane co‑polymer engineered to deliver dependable performance in demanding concrete preservation environments. Applied as a 1/4" to 3/8" single‑ or dual‑layer system, it forms a durable, chemical‑resistant, and waterproof protective...

A low viscosity, premium quality, UL Classified, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. The lower viscosity of DP 3060 makes it an ideal lap adhesive for pipe insulation...

EPC-OVERLAY is an all-in-one, 100% solids, solvent-free, moisture-insensitive, high-performance, multi-purpose epoxy polymer concrete overlay system. This next generation system is easy-to-use and cost-effective, combining a low-modulus epoxy resin system with a high-quality engineered blend of graded aggregate to...

DP Wrap is a polyethylene film with a high-tack adhesive designed to provide protection from moisture, dust, debris, and paint. The film is easily removed, tear resistant and UV resistant.Covering round and rectangular duct during transportation, storage and...

CRACKBOND® BRIDGE-GARD is a multi-purpose epoxy polymer concrete overlay system designed for high-stress infrastructure applications. It may be successfully applied and cured at temperatures between 65 °F and 95 °F (18 °C and 35 °C).