EPO-TEK® OM125 - Optical Epoxy Adhesive

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

C-CLEAN100 is a heavy-duty stripper and degreaser that is used for general cleaning and degreasing of concrete surfaces, tools and equipment.

Pentra-Finish™ (HG) is the highest performing stain and wear protection finish for polished concrete, terrazzo, masonry and other cementitious surfaces. This patented, high-gloss, easy-to-use lithium sealer, creates a microfilm that will not peel, flake or bubble and improves...

A foil backed butyl mastic rolled sealant tape that is fully cured, high pressure/high velocity rated for use on commercial and residential supply and return air ducts. DP Foil Mastic Tape is pressure sensitive and requires no cure...

EP50-OVERLAY is a solvent-free, moisture-insensitive, 100% solids, low-modulus, two-component polymer designed primarily for bonding skid-resistant overlays.