EPO-TEK® P1011S-2 - Silver Die Attach Polyimide

Single component, modified polyimide, high temperature grade, silver-filled electrically conductive and thermally conductive adhesive designed for semiconductor die-attached and hybrid microelectronic packaging.

TDS
Where to buy

Related Products

Viewing options:

Get in touch to learn more

Speak to us on 1-978-667-3805

Contact us