Features
- Environmentally safe
- Non-flammable, odorless
- Penetrates to aid curing
- Helps prevent plastic shrinkage cracks
- Dustproofs interior and exterior surfaces
- Does not need to be removed prior to the application of subsequent sealers, paints, adhesives, flooring materials, waterproofing, etc.
- Provides contractors, architects, engineers and owners with a simple solution to compatibility and discoloration issues
- Moisture loss of 0.67 kg/sq. m
Related Products

ASI 57
Hybrid Polymer Sealant and Adhesive
ASI 57 Hybrid Class 50 Hybrid Sealant and Adhesive is a one-part, low odor, no-sag polyether sealant that uses ASI’s innovative hybrid technology to produce a material that is ideal for a wide range of applications where a...

EPO-TEK® MED-H20E
Medical Grade Conductive Epoxy
ISO 10993 biocompatible electrically conductive (ECA) silver-filled epoxy with electrical and high thermal conductivity. It is a well characterized and relied upon ECA, with over 40 years of successful design use.

EP-SLV
Low Viscosity Exposy Adhesive
EP-SLV is a 100% solids, high-modulus, moisture-insensitive, very low-viscosity epoxy adhesive for gravity feed or pressure injection of cracks in concrete. EP-SLV is a structural repair adhesive designed primarily for pressure injection and gravity feed crack repair in...

CRACKBOND® JF-82 FAST
Fast Cure Polyurea Joint Filler
Rapid curing, polyurea control joint filler designed for heavy duty traffic and freezer applications. Low viscosity, self leveling and allows for 10-15% movement of installed joint width. Available in cartridges and bulk.

CRACKBOND® V120 LO-MOD
Epoxy Concrete Sealer
CRACKBOND® V120 LO-MOD is a two-component, moisture insensitive, low modulus, high strength epoxy healer/sealer penetrant, designed to seal micro cracks in bridge and parking structure decks and as an overlay for high friction surface treatment. The super-low viscosity...

EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
ASI 57
Hybrid Polymer Sealant and Adhesive
ASI 57 Hybrid Class 50 Hybrid Sealant and Adhesive is a one-part, low odor, no-sag polyether sealant that uses ASI’s innovative hybrid technology to produce a material that is ideal for a wide range of applications where a...
EPO-TEK® MED-H20E
Medical Grade Conductive Epoxy
ISO 10993 biocompatible electrically conductive (ECA) silver-filled epoxy with electrical and high thermal conductivity. It is a well characterized and relied upon ECA, with over 40 years of successful design use.
EP-SLV
Low Viscosity Exposy Adhesive
EP-SLV is a 100% solids, high-modulus, moisture-insensitive, very low-viscosity epoxy adhesive for gravity feed or pressure injection of cracks in concrete. EP-SLV is a structural repair adhesive designed primarily for pressure injection and gravity feed crack repair in...
CRACKBOND® JF-82 FAST
Fast Cure Polyurea Joint Filler
Rapid curing, polyurea control joint filler designed for heavy duty traffic and freezer applications. Low viscosity, self leveling and allows for 10-15% movement of installed joint width. Available in cartridges and bulk.
CRACKBOND® V120 LO-MOD
Epoxy Concrete Sealer
CRACKBOND® V120 LO-MOD is a two-component, moisture insensitive, low modulus, high strength epoxy healer/sealer penetrant, designed to seal micro cracks in bridge and parking structure decks and as an overlay for high friction surface treatment. The super-low viscosity...
EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.


Get in touch to learn more
Speak to us on 505-217-2121
Contact us

















