Meridian Adhesives Group offers advanced adhesive solutions designed to meet the unique demands of the automotive and transportation industry. Our products are engineered to enhance performance, durability, and safety across a variety of applications, from assembly and manufacturing to repair and sealing.
With a focus on innovation, our adhesives provide reliable bonding, sealing, and protection, ensuring the highest standards of quality and efficiency in the rapidly evolving transportation sector. Whether improving energy efficiency or enabling new technologies, Meridian’s solutions are key to driving the future of mobility.
15 manufacturing facilities
18 R&D and QC support labs
25 total locations
Technology
Meridian Adhesives Group provides innovative adhesive and sealant technologies tailored to the evolving needs of the Automotive and Transportation markets, ensuring performance, durability, and safety.
- Diverse range of adhesive technologies, including epoxy, silicone, hybrid SMP, and acrylics, designed for automotive and transportation applications.
- Formulated to withstand harsh environments, high temperatures, and demanding operational requirements.
- Delivering next-generation solutions through collaboration with industry leaders to enhance vehicle performance and manufacturing efficiency.
Applications
Our adhesive solutions drive efficiency, safety, and reliability for cutting-edge automotive and transportation applications.
- High-performance adhesives for ADAS, camera, LIDAR, and RADAR systems, providing precision bonding for enhanced sensor accuracy.
- Advanced materials for EV battery, motor, and charger applications, delivering thermal management, durability, and electrical insulation.
- Tailored adhesive solutions for manufacturing and assembly, improving production speed and structural integrity across the supply chain.
Featured Products
50-3152FR
Thermally Conductive Potting Epoxy
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
ASI 6900
Quick Grab Adhesive for Heavy Duty Applications
ASI 6900 Extreme Fast-Grab Hybrid Adhesive grabs and holds substrates within just a few seconds, making it ideal for holding heavy objects in place while adhesive cures to form a long-term, durable bond. This reduces or eliminates the...
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