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EPO-TEK® HYB-353ND-LV
Low Viscosity UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...
EPO-TEK® 730
Thixotropic Epoxy Adhesive
All purpose thixotropic and room temperature-curing epoxy adhesive.
60-7107RTR
Electronic Epoxy Adhesive
Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.
70-3812NC
Aluminum Filled Epoxy
Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.
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UV Curable Urethane Adhesive & Encapsulant
Non-yellowing UV urethane adhesive and encapsulant.
EPO-TEK® OG198-55
Biocompatible UV Curing Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.
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