We provide a comprehensive range of advanced adhesive solutions, meticulously engineered to meet the diverse demands of the optical, 5G telecom, and datacom industries, including AI data centers, high-speed data transmission devices, fiber-optic cabling fiber-optics components, microwave, satellite communication, camera modules, LIDAR, and radar.
We offer optical adhesives/encapsulants, thermally conductive adhesives, thermally & electrically conductive adhesives, active alignment adhesives, structural bonding adhesives, low CTE adhesives, high Tg and low-temperature cure adhesives, UV curable, and UV Hybrid adhesives. We understand the challenges in 5G Telecom, AI data centers to address miniaturization, good connectivity, compatibility with a wide range of materials and interfaces, thermal management, and rigorous environmental endurance tests. Our materials are engineered to exceed the stringent Telcordia GR-1221 low outgassing standards.
15 manufacturing facilities
18 R&D and QC support labs
25 total locations
Technology
Meridian’s specialized adhesive technologies for the Optical, Datacom, and Telecom markets ensure precision and stability in high-speed, high-performance environments.
- Our epoxy and silicone formulations are engineered for optical clarity, thermal management, and reliable bonding, essential for advanced optical and datacom applications.
- Designed to support the delicate components in fiber optics and telecommunications equipment, our adhesives maintain integrity in high-temperature and high-moisture conditions.
- Through collaboration with industry leaders, we offer solutions that enhance the reliability and efficiency of critical connectivity infrastructure.
Application
We deliver adhesive solutions that enable peak performance and longevity in Optical, Datacom, and Telecom applications.
- For fiber optics and fiber optic modules, our adhesives provide precise alignment and secure bonding, ensuring signal integrity and high-speed data transmission.
- In data centers, our materials support thermal management and long-term stability, essential for maintaining optimal equipment performance.
- Our solutions for optical sensors and camera modules offer durability and clarity, crucial for accurate data capture and image quality across various applications.
Featured Products
EPO-TEK® 301
Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.
EPO-TEK® 323LP
Optical Grade Epoxy
Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications. Fiber optic adhesive designed to meet Telecordia 1221.
50-3152FR
Thermally Conductive
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.
