Features
- Electrically insulating
- Low shrinkage
- Low outgassing with CAT.190
Applications
- Potting for transformers, power supplies, electric motors, etc.
- Intrinsic safety
Downloads
Related Products

20-2175
Thixotropic Polyurethane Encapsulant
Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.

20-2180 Series
Low Toxicity Polyurethane
Medium hardness polyurethane with excellent dielectric strength and low toxicity. Also available as faster gelling versions 20-2183 and 20-2184. Softer Shore A Hardness versions available as 20-2101, 20-2140, and 20-2160.

EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping

EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

20-3305
Thermal Shock Resistance Epoxy
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.
20-2175
Thixotropic Polyurethane Encapsulant
Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.
20-2180 Series
Low Toxicity Polyurethane
Medium hardness polyurethane with excellent dielectric strength and low toxicity. Also available as faster gelling versions 20-2183 and 20-2184. Softer Shore A Hardness versions available as 20-2101, 20-2140, and 20-2160.
EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
20-3305
Thermal Shock Resistance Epoxy
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.


Get in touch to learn more
Speak to us on 401-946-5564
Contact us

















