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CONVERGENT SlabArmor™ Closer
Colloidal Silica Concrete Densifier/Hardener
SlabArmor™ Closer is the second step in the SlabArmor system. This colloidal silica densifier/hardener is applied after power troweling has been completed. A single application is applied to the surface and requires no scrubbing or rinsing. Its reactive...

10-3063
Water Resistant Adhesive
Water resistant, room temperature cure adhesive that meets FDA regulations Sections 175.105 and 175.300 permitting use in "indirect" food contact applications.

EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.

EPO-TEK® 353ND
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TRANSIL® 244(+)
Densifying Waterproofer and Chloride Ion Barrier
Transil® 244(+) is a premium Nano-Lithium® hardener, densifier, and hydrophobic sealer ideal for protecting concrete and masonry surfaces against damage from freeze-thaw cycles, moisture, and chloride ion intrusion.
CONVERGENT SlabArmor™ Closer
Colloidal Silica Concrete Densifier/Hardener
SlabArmor™ Closer is the second step in the SlabArmor system. This colloidal silica densifier/hardener is applied after power troweling has been completed. A single application is applied to the surface and requires no scrubbing or rinsing. Its reactive...
10-3063
Water Resistant Adhesive
Water resistant, room temperature cure adhesive that meets FDA regulations Sections 175.105 and 175.300 permitting use in "indirect" food contact applications.
EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.
EPO-TEK® 353ND
Low Outgassing Optical Epoxy
High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.


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