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ASI 12SK
Hi-Flex Butyl Sealant
ASI 12SK Butyl Sealant is a one part, butyl-based sealant formulated to perform better than the average butyl by using synthetic fibers for more flexibility, better adhesion and greater versatility.ASI 12SK provides a long-term seal between all types...
EPO-TEK® H70E
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Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
EPO-TEK® HYB-353ND-TX2
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A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.
ASI 388
Electronic Grade RTV Silicone
ASI 388 Electronic Grade RTV Silicone is a one part, moisture cure sealant that cures to form a tough, durable, flexible rubber that is deal for bonding, sealing, encapsulating and protecting electronic parts.Once cured, ASI 388 will withstand...
DP 5060
LOW VISCOSITY WATER BASED WEATHER BARRIER COATING
A premium quality, low viscosity, Low VOC, water based, high strength, quick drying, low odor weather barrier coating. DP 5060 is recommended for indoor and outdoor use where a breather mastic is required. It is used for bonding...
EPO-TEK® T7109
Thermally Conductive Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
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