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DP 2590 / DP 2590 CA
SOLVENT BASED SPRAY ADHESIVE
Premium quality, solvent based, fast drying, non-flammable liquid adhesive, pressure sensitive fiberglass duct liner insulation adhesives. They are supplied in convenient spray canister systems which are both portable and cost effective. DP 2590 CA is available as a...
Enhance®
Cutback Adhesive Encapsulator and Bond Promoter
Take your job site to the next level with Enhance. Its multi-functioning capabilities tackle many tough challenges such as detackifying or encapsulating existing adhesive residue, including cutback. Even difficult-to-bond substrates are no match for the textured surface profile...
DP 88
Spray Edge Coating
DP 88 is an aerosol spray edge coating or “duct butter” formulated to quickly and conveniently coat cut or damaged insulation.DP 88 combines the advantages of quick drying aerosol adhesives with the tack-free and flexible properties of sealants...
EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping
XD-CURE
Concrete Curing Compound and Sealer
XD-CURE is a clear, odorless, water-based concrete curing compound that is formulated to ensure proper concretestrength development, help prevent shrinkage cracks, and leave a bondable surface for further coatings, treatments or flooring materials.
EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.
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